INTELLIGENCE
BEYOND THE
BOTTLENECK
AI is no longer just software — it's an industrial process. Fabric.AI introduces MicroLED-based optical interconnects as the first in a broader suite of fabless semiconductor technologies designed specifically for AI workloads — not retrofitted from general-purpose systems. We are building the technologies that power AI factories: smart data centers optimized for continuously producing intelligence at scale.
AI BROKE THE DATA CENTER
Traditional data centers were designed for general-purpose computing. They were never built to handle the massive data movement, coordination, and efficiency demands of modern AI workloads.
Modern AI models require thousands of accelerators exchanging data simultaneously. Existing electrical interconnects degrade, overheat, and bottleneck at scale — they were never designed for this.
AI factories require ongoing production loops — training, refining, generating — without interruption. Any latency or bandwidth constraint cascades into degraded model performance and efficiency loss.
AI racks now hit 50–140 kW. U.S. data centers face a 49 GW shortfall by 2028. Copper interconnects generate resistive heat and consume power even when idle — compounding the crisis.
Copper Interconnects
- Signal degrades over distance
- Bandwidth ceiling hits fast at AI scale
- High resistive heat generation
- Power inefficiency rises with density
- Cannot scale beyond the rack economically
Traditional Laser Optics
- Difficult and expensive to manufacture at volume
- Significant thermal management challenges
- Complex, costly packaging requirements
- Limited density per module
- Reliability constraints at hyperscale
A NEW CLASS OF
SEMICONDUCTOR
TECHNOLOGY
Fabric.AI introduces MicroLED-based optical interconnects as the first in a broader suite of fabless semiconductor technologies designed specifically for AI workloads — not retrofitted from general-purpose systems.
Speed
Photons instead of electrons — ultra-high-bandwidth, low-latency communication at the speeds AI factories demand. GPU-to-GPU at Tbps with sub-nanosecond latency.
- Eliminate interconnect bottlenecks between GPUs
- Enable real-time distributed AI workloads
Efficiency
Significantly lower power per bit transmitted — improving data center economics while addressing the power crisis that's blocking AI infrastructure growth globally.
- Reduce thermal load and cooling demands across racks
- Improve overall data center PUE at scale
Scale
Designed for AI factories — not just racks. A cohesive system that tightly couples compute, communication, and coordination at hyperscale. Foundation for the full semiconductor suite.
- Scalable, high-density interconnect architectures
- Foundation for a broader AI semiconductor suite
BUILT WITH
KOPIN CORPORATION
Fabric.AI's interconnect technology is developed in close collaboration with Kopin Corporation (KOPN), combining Fabric.AI's system-level semiconductor design with Kopin's deep expertise in MicroLED materials, process development, and fabrication.
Both companies jointly develop and share the intellectual property created through the partnership — establishing a defensible technology position in AI infrastructure that will define the next era of data center connectivity.
"MicroLED technology represents a powerful new frontier beyond displays. Our collaboration with Fabric.AI extends the reach of our technology into AI infrastructure, enabling a new class of interconnect solutions designed for scale, efficiency, and performance."Michael Murray — CEO, Kopin Corporation
MicroLED vs. Legacy Technologies
| Metric | Copper | MicroLED Optical |
|---|---|---|
| Power per bit | Rises sharply with scale | Significantly lower — stays low |
| Heat generation | High — resistive thermal ceiling | Low — no resistive losses |
| Bandwidth scaling | Limited by physics | Scalable linearly |
| Density | Constrained by signal degradation | Massive — optical channels |
| Latency | Increases with distance | Consistent, ultra-low |
| AI factory fit | Retrofitted — not purpose-built | Designed from the ground up |
// Fabric.AI — AI Factory Interconnect Architecture
BUILT BY THE PEOPLE WHO
UNDERSTAND THE PROBLEM
We are a team of engineers, physicists, and AI infrastructure experts who saw the connectivity wall coming — and decided to build the way through it. Our mission: transform data centers into unified production systems for artificial intelligence.
Deep Tech Founders
We come from semiconductor, photonics, and AI systems backgrounds. We've built things at scale before — and understand that the infrastructure layer defines the era.
Infrastructure First
We believe the companies that define the foundational layers of computing define the future. Fabric.AI is building the semiconductor technologies that sit at that foundation.
AI Factory Vision
We're not just building interconnects — we're building the first component of a cohesive suite of fabless semiconductor technologies designed specifically for AI factories.
Long-Term Thinking
We're not building for the next product cycle. We're building the fabric that will underpin how intelligence is produced at industrial scale for the next decade.
PARTNER WITH THE
FABRIC LAYER
Fabric.AI is building foundational semiconductor infrastructure for the AI era — beginning with MicroLED interconnects and expanding into a broader suite of system-critical technologies. If you're interested in backing the connectivity layer of the next compute paradigm, we'd like to speak with you.